The 11th Semiconductor Equipment Materials and Core Components Exhibition

The 11th China Electronics Special Equipment Industry Association Semiconductor Equipment Annual Conference and Industry Chain Cooperation Forum was grandly held in Wuxi, Jiangsu from August 9th to 11th, 2023. The conference lasted for three days, with the theme of "working together to seize opportunities and integrate innovative equipment manufacturing". Centered on the purpose of "high-level, professional, and industrialized", and in the form of "forum+exhibition", a semiconductor equipment based conference was built, creating an opportunity for technical communication, economic exchange, trade exchanges, product innovation, and market development.

This conference also invited experts from the semiconductor related industry chain, enterprises, talent elites from universities, and relevant leaders to discuss the semiconductor equipment market together. Through academic research, market research, and policy analysis by the attendees, they expressed their opinions and explored the future development path. Bringing cutting-edge and core semiconductor industry information and technology to attendees, providing a platform for mutual communication and learning for the development of the semiconductor industry.

Jiangsu Jinggong has become the only manufacturer in China to replace imported chamfering machines.

At the exhibition, Jiangsu Jinggong presented in detail the technical advantages and usage methods of MET-5600 to participating experts. MET-5600 is a specialized equipment for wafer chamfering, which uses precision grinding wheels to grind and shape wafers. Chamfer and polish the edges of semiconductor wafers made of compounds such as silicon, indium phosphide, gallium arsenide, silicon carbide, and sapphire. Featuring a wide range of optional features. It has the characteristics of high precision, high-quality grinding surface, minimal material loss, accurate crystal orientation, and stable operating state.