Product Description

Single wafer brushing Machine QX-2000 is designed for compound semiconductor wafer materials such as SiC wafer, sapphire and etc, which is mainly used to clean the particles on the surfaces of the substrates. The equipment can be equipped with specific brushing station according to clients needs. First, use a PVA brush to brush, combined with two fluids and a chemical solution (according to clients needs), and after drying, particles and other residues on the wafer surface can be effectively removed. The machine is suitable for brushing 6-8 inch substrates.

Product Advantages

Flexible

① Can process 4-6-8 inches various material wafer, can provide customized size services according to customer needs

② The number of brush cavities can be customized according to customer requirements, with a maximum of 12 cavities available

③ Wafer thickness: 320-1000um

Convenient software configuration

Customers can set the formula in the system according to their own process requirements, and the system can set password management

High yield

① By rotating the robotic arm in the same cavity, the front and back side of wafer are brushed with high efficiency

② One piece of wafer can be brushed within 5 minutes (6 inch OF SiC wafer ), with high production capacity

Product Specifications

Product video

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