Product Description
Wafer wax coating machine AET-2000B is designed for semiconductor wafer materials. By cylinder and air bag control, the flatness of the wax coating can reach 2um, and it is compatible with 248mm, 360mm and 485mm ceramic discs. The machine is equipped with high-efficiency robot arm ,precision actuator and self-developed control system which ensure stable operation, high repeated positioning accuracy and production capacity
Advantage
Wafer wax coating machine AET-2000B Specification
Model | AET-2000B |
Wafer size | 2-6 inches、4-8 inches |
Wafer type | SiC,sapphire, InP ect |
Machine size and weight | L2600mmxW1200mmxH1930mm;1100Kg |
Wax coating method | Centrifugal |
Heating method and accuracy | Electric heating tube, ±1℃ |
Pressing and pasting method | Air bag |
Loading and unloading methods | Efficient robotic arm and automatic tranfer |
Robot arm transfer wafer method | Ceramic finger vacuum adsorption |
Heating plate temperature control , range | 40-80℃ |
wax coating flatness | ≤2um |
Was coating repeated positioning accuracy | ±0.05mm |
Was coating amount accuracy | ±0.02g |
Loading platform | 2 cassette |
Automatic requirements | Semi-automatic: robot arm automatic transfer wafer to wax coating station, manual unloading wafer and manual loading,unloading and cleaning of ceramic discs. fully automatic:robot arm automatic transfer wafer to wax coating station, automatic unloading wafer. loading,unloading and cleaning of ceramic discs is automatically finished by robot arm. |