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Wafer wax coating machine AET-2000B

Wafer wax coating machine AET-2000B is designed for semiconductor wafer materials.
Wafer wax coating machine AET-2000B
Wafer wax coating machine AET-2000B

Product Description


Wafer wax coating machine AET-2000B is designed for semiconductor wafer materials. By cylinder and air bag control, the flatness of the wax coating can reach 2um, and it is compatible with 248mm, 360mm and 485mm ceramic discs. The machine is equipped with high-efficiency robot arm ,precision actuator and self-developed control system which ensure stable operation, high repeated positioning accuracy and production capacity


Advantage


Flexible
① Can process 2-6 inches and 4-8 inches various material wafer
② Easily switch to process different size of wafer
③ Enclosed space during waxing coating, ensure the surface cleanness
High-precision
① High repeated positioning accuracy
② Precision heating and automatic cooling system are used inside the heating and cooling plate, which can accurately control the temperature of the plate
③ Flatness of the wax coating can reach 2um
Customization
① Semi-automatic: robot arm automatic transfer wafer to wax coating station, manual unloading wafer and manual loading,unloading and cleaning of ceramic discs.
② Fully automatic:robot arm automatic transfer wafer to wax coating station, automatic unloading wafer. loading,unloading and cleaning of ceramic discs is automatically finished by robot arm.
③ Can be customized according to client’s requirements
Multiple processing specifications
Suitable for various semiconductor substrate materials before polishing.


Wafer wax coating machine AET-2000B Specification


Model

AET-2000B

Wafer size

2-6 inches、4-8 inches

Wafer type

SiC,sapphire, InP ect

Machine size and weight

L2600mmxW1200mmxH1930mm;1100Kg

Wax coating method

Centrifugal

Heating method and accuracy

Electric heating tube, ±1℃

Pressing and pasting method

Air bag

Loading and unloading methods

Efficient robotic arm and automatic tranfer

Robot arm transfer wafer method

Ceramic finger vacuum adsorption

Heating plate temperature control , range

40-80℃

wax coating flatness

≤2um

Was coating repeated positioning accuracy

±0.05mm

Was coating amount accuracy

±0.02g

Loading platform

2 cassette

Automatic requirements

Semi-automatic: robot arm automatic transfer wafer to wax coating station, manual unloading wafer and manual loading,unloading and cleaning of ceramic discs.

fully automatic:robot arm automatic transfer wafer to wax coating station, automatic unloading wafer. loading,unloading and cleaning of ceramic discs is automatically finished by robot arm.