Product Description

Wafer wax coating machine AET-2000B is designed for semiconductor wafer materials. By cylinder and air bag control, the flatness of the wax coating can reach 2um, and it is compatible with 248mm, 360mm and 485mm ceramic discs. The machine is equipped with high-efficiency robot arm ,precision actuator and self-developed control system which ensure stable operation, high repeated positioning accuracy and production capacity

Advantage

Flexible

① Can process 2-6 inches and 4-8 inches various material wafer

② Easily switch to process different size of wafer

③ Enclosed space during waxing coating, ensure the surface cleanness

High-precision

① High repeated positioning accuracy

② Precision heating and automatic cooling system are used inside the heating and cooling plate, which can accurately control the temperature of the plate

③ Flatness of the wax coating can reach 2um

Customization

① Semi-automatic: robot arm automatic transfer wafer to wax coating station, manual unloading wafer and manual loading,unloading and cleaning of ceramic discs.

② Fully automatic:robot arm automatic transfer wafer to wax coating station, automatic unloading wafer. loading,unloading and cleaning of ceramic discs is automatically finished by robot arm.

③ Can be customized according to client’s requirements

Multiple processing specifications

Suitable for various semiconductor substrate materials before polishing.

Wafer wax coating machine AET-2000B Specification