Product Description
Edge/Notch Profile Measurement equipment WEP-200E is a wafer Edge/Notch Profile Measure equipment for semiconductor wafer materials after edge grinding. By non-contact measurement method, the equipment can measure Edge Shape, Notch Shape, Orientation Flat Length, Wafer Diameter,edge width,edge chipping, etc. The measurement results can be automatically stored and data can be exported.The equipment is suitable for 2/3/4/5/6/8/12 inches wafers.
Measurement Method and Measurement Items
Wafer edge R shape measurement example
Wafer width of chamfer X1、X2 measurement precision accuracy deviation: ±10um
R angle measurement precision accuracy deviation: ±10um
Wafer length of chamfer X1、X2 measurement precision accuracy deviation: ±10um
Angle A1, A2 measurement precision accuracy deviation: ±0.5°
The notch depth Vh and notch width Vw notch measurement precision accuracy deviation: ±1um
Edge/Notch Profile Measurement System WEP-200E Specification
Model | WEP-200E |
Wafer size | 2/3/4/5/6/8/12 inches |
Wafer materials | Si, Ge,GaAs,InP,SiC,GaN,LN/LT sapphire etc |
Data reading and exporting | OK |
Wafer Edge shape measurement function | OK |
Notch shape measurement function | OK |
R shape、double R shape measurement function | OK |
Notch width,depth | ±1μm |
angle measurement repeatability | ±1° |
Wafer diameter | ±1μm |
Wafer thickness | Up to 1600um |
width of chamfer accuracy | ±10um |
Thickness accuracy | ±5μm |
R accuracy 、R repeatability | ±5um |