Product Description
Single wafer cleaning Machine QX-6800 is designed for semiconductor wafer materials. by chemical solution cleaning, can effectively remove the particles, metal pollutants and other organic substances on the surface of wafer/epitaxial wafer.
Product Advantage
- Flexible
- ① Can process 4-6 and 6-8 inches various material wafer
- ② Easily switch to process different size of wafer, no need to switch parts
- ③ Equipment cavity can be designed according to client’s requirements
- Chemical solution treatment
- Separate reclaim of Chemical solution to reduce factory processing costs
- software program
- Provides 10 process recipe storage and each recipe can be set with 20 step programs
- High production capacity
- By dual robot arm to complete front and back side cleaning in the same cavity, high efficiency and no cross contamination.
- Significant cleaning effect
- Can provide cleaning know-how
- Number of 0.2um wafer particles ≤ 30
- Metal ions ≤ 5E10 atoms/cm2
- Multiple application processes
- Applied in final cleaning, pre epitaxial cleaning, after CMP cleaning, etc.
Product Specification
Model | QX-6800 |
Wafer size | 4-6 inches、6-8 inches |
Wafer thickness | 300um-1200um |
Number of cavity | according to client’s requirements.，Up to 12cavities |
MACHINE SIZE and weight | according to client’s requirements |
Chemical solution | Separate control，no cross contamination. |
Chemical solution control | Precise control system for nozzle Chemical solution flow rate |
Brushing function | Equipped PVA brushing function according to client’s requirements |
Loading and unloading method | dual robot arm auto transfer |
Robot arm transfer wafer method | Ceramic vacuum adsorption /pin edge support |
Cleaning chuck fix wafer method | Chuck vacuum adsorption /pin edge support |
Wafer cleaning side | Front and back |
Dry method | Centrifugal dehydration |
wafer requirement | Dry in dry out |
Loading platform | cassette |
Numbers of cassette | 4 set（2 loading cassette、2 unloading cassette） |