Product Description
Wafer batch Cleaning machine KT-3000T is a wet cleaning machine designed for semiconductor wafer materials, which is used to clean particles, metal contaminants and other organic matter on the front and back of wafer. The machine is compatible with 4-6 inch and 6-8 inch wafers, equipped with high-efficiency robot arm,high repeat positioning accuracy and high production capacity. Self-developed software system ensures the control of process parameters, including the setting and modification of know-how, storage and invocation of process programs.
Advantage
Flexible
① Can process 4-6 and 6-8 inches various material wafer
② Can continuously clean 10 processes with 25 pcs of wafers per process
Safe
During the cleaning process, the cassette of wafer transfer in a closed environment, which can prevent acid and alkali aerosol from spilling into air.
Digital control
Know-how storage, automatic mixing, adding and refilling of 5 kinds of cleaning chemical solution.
Customization
Number of tanks is designed according to the client’s process requirements
Multiple application processes
Suitable for pre-CMP cleaning, RCA cleaning, pre/post-diffusion cleaning, epitaxial cleaning, etc
Wafer batch Cleaning machine KT-3000T Specification
Model | KT-3000T |
Wafer size | 4-6 inches、6-8 inches |
Wafer amount | 25pcs/time or 50pcs/time |
Wafer thickness | 320-1000μm |
Wafer transfer method | Efficient robotic arm automatic transfer |
number of tank | according to the client’s process requirements |
Machine size and weight | according to the client’s process requirements |
Cleaning process | Wafer loading→SPM→HQDR→DHF→QDR→SC1→QDR→SC2→QDR→dry-wafer unloading（modified according to the client’s process requirements） |
Chemical solution function | automatic mixing, adding and refilling of cleaning chemical solution. |
Detection of chemical solution concentration | Equipped according to the client’s process requirements |
Mega Cleansing | Equipped according to the client’s process requirements |
Wafer cleaning side | Front and back side of wafer |
Drying method | Nitrogen drying |